Electronic passports prepare for check-in

Junko Yoshida reports in EE Times on next generation travel documentation.

The transition from contact to contactless technologies, the electronic storage of biometric data and the integration of cryptographic engines will converge to define the next generation of travel documentation systems, predicts Detlef Houdeau , senior director for business development ID projects at Infineon Technologies’ Secure Mobile Solutions business group (Munich). The German semiconductor company is involved in projects in five countries. In each, Infineon, collaborating with a secure printing company authorized by the country in question, is developing chips that can be reliably woven into a page of a machine-readable passport.

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